{"id":3350,"date":"2026-09-16T13:51:02","date_gmt":"2026-09-16T13:51:02","guid":{"rendered":"https:\/\/duolinkelectronics.com\/?p=3350"},"modified":"2026-09-16T13:51:05","modified_gmt":"2026-09-16T13:51:05","slug":"so-uberprufen-sie-die-kennzeichnungen-auf-ics-etiketten-und-verpackungen-vor-dem-kauf","status":"publish","type":"post","link":"https:\/\/duolinkelectronics.com\/de\/so-uberprufen-sie-die-kennzeichnungen-auf-ics-etiketten-und-verpackungen-vor-dem-kauf\/","title":{"rendered":"So \u00fcberpr\u00fcfen Sie die Kennzeichnungen, Etiketten und Verpackungen des Modells IC vor dem Kauf"},"content":{"rendered":"

Two genuine ICs with the same base part number may look different. One may come from another assembly plant. A manufacturer may change its marking equipment, label layout, package supplier, or trace-code format. Small packages also have less space, so the manufacturer may print a shortened top mark instead of the full ordering code.<\/p>\n\n\n\n

When I review an IC offer, I do not reject a batch because its font differs from one photo found online. I first check whether the difference can be traced to the package, production period, assembly location, or product revision.<\/p>\n\n\n\n

Ask the supplier for photos of the current inventory before confirming the order. Catalog pictures and photos from a previous shipment tell you very little about the parts you will receive. The supplier should show the IC body, underside, leads or terminals, reel label, tray or tube, moisture barrier bag, and outer carton.<\/p>\n\n\n\n

IC markings, labels, and packaging form the first screening layer. They can reveal wrong parts, mixed lots, remarking, weak traceability, or poor storage. They cannot prove authenticity by themselves. A copied barcode may still scan. A remarked component can have a clean surface. You need to compare every piece of evidence and check whether the information agrees.<\/p>\n\n\n\n

Buyers who need more background on IC construction and package families can read this guide to integrated circuit types, functions, and applications<\/a>.<\/p>\n\n\n\n

1. Confirm the exact IC part number before checking appearance<\/h2>\n\n\n\n

Break down the full manufacturer part number<\/h3>\n\n\n\n

Start with the complete manufacturer part number, or MPN. The logo and surface finish can wait.<\/p>\n\n\n\n

The base number usually identifies the device family. Letters and numbers before or after it may define the package, temperature grade, speed, voltage option, lead finish, qualification level, or packing method.<\/p>\n\n\n\n

A supplier may quote the correct base number while offering a different suffix. The IC can be genuine and still be wrong for your production line.<\/p>\n\n\n\n

Part-number field<\/th>Was damit festgestellt werden kann<\/th>Risk if it is missed<\/th><\/tr><\/thead>
Base part number<\/td>Device family and electrical function<\/td>The IC performs the wrong function<\/td><\/tr>
Package suffix<\/td>Body style, pin count, and footprint<\/td>The device does not fit the PCB<\/td><\/tr>
Temperature code<\/td>Rated operating range<\/td>The part does not meet the application conditions<\/td><\/tr>
Speed or performance code<\/td>Frequency, timing, or accuracy<\/td>The device falls outside the design requirement<\/td><\/tr>
Environmental suffix<\/td>Lead finish or compliance version<\/td>Assembly or compliance documents do not match<\/td><\/tr>
Packing suffix<\/td>Reel, tray, tube, or cut tape<\/td>The parts cannot enter the planned production process<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

Use the ordering-information table in the manufacturer datasheet. Read each character in the quoted MPN and compare it with the purchase specification.<\/p>\n\n\n\n

Keep the packing suffix on the purchase order when it controls the supply format. It may not appear on the IC body, but it still describes what the supplier must deliver.<\/p>\n\n\n\n

Match the package type against the datasheet<\/h3>\n\n\n\n

Compare the offered package with the manufacturer\u2019s package drawing. Check the body length, width, height, pin count, lead pitch, terminal style, exposed pad, and pin-one indicator.<\/p>\n\n\n\n

Similar packages can be easy to confuse in ordinary photos. SOIC and TSSOP packages may have the same number of pins but different body dimensions and lead pitches. QFN and DFN devices may look alike until you inspect the underside. A BGA check should include the body dimensions and ball configuration.<\/p>\n\n\n\n

Ask for a clear top view, side view, and bottom view. If you need measurements, request a photo showing the component beside a calibrated measuring tool. The supplier should not rely on the reel label alone.<\/p>\n\n\n\n

An obvious package conflict should stop the review. A 44-lead component cannot satisfy a datasheet that specifies a 48-lead TQFP, even if the printed base number looks correct.<\/p>\n\n\n\n

You can compare available product families in the integrated circuits category<\/a> and then confirm the details through the original manufacturer\u2019s datasheet.<\/p>\n\n\n\n

Check whether the part is active, obsolete, or replaced<\/h3>\n\n\n\n

Review the manufacturer\u2019s product page, product change notices, discontinuation notices, and replacement information.<\/p>\n\n\n\n

The dates need to make sense. An obsolete IC may remain available as unused stock for years. That situation is common with repair, industrial, and legacy equipment. A date code showing production long after the manufacturer\u2019s final manufacturing date deserves further investigation.<\/p>\n\n\n\n

Ask the supplier when the material entered its inventory and whether it came through an authorized distributor, original equipment manufacturer, contract manufacturer, broker, or previous stockholder. For discontinued parts, request any available original label and purchase trace.<\/p>\n\n\n\n

A newer date code is not automatically better. Older components can remain usable when the manufacturer\u2019s storage requirements were followed. Package condition, terminal oxidation, moisture exposure, and solderability matter more than the age printed on the label alone.<\/p>\n\n\n\n

\"Scanning
Scanning An IC Reel Label For Verification<\/figcaption><\/figure>\n\n\n\n

2. Examine the markings printed on the IC body<\/h2>\n\n\n\n

Compare the logo, font, spacing, and marking position<\/h3>\n\n\n\n

Request high-resolution photos of several devices from the offered lot. One carefully selected component cannot represent a full reel or tray.<\/p>\n\n\n\n

Check the manufacturer logo, character shape, line spacing, text position, marking depth, and pin-one symbol. Compare the direction and location of the markings across the sampled units.<\/p>\n\n\n\n

Some variation is normal. Assembly plants may use different marking equipment. One factory may apply ink while another uses a laser. A small package may carry a short code, while a larger version shows the complete device number. Manufacturers may also revise a logo or move trace information to the underside.<\/p>\n\n\n\n

Compare the offered devices with marking guides, package drawings, manufacturer photos, and known-good samples from the same product family. A single online image is a weak reference because its production period and assembly location may be unknown.<\/p>\n\n\n\n

Decode the top mark, date code, and lot code<\/h3>\n\n\n\n

The lines printed on an IC can represent different types of information.<\/p>\n\n\n\n

Marking element<\/th>Common purpose<\/th>What the buyer should check<\/th><\/tr><\/thead>
Full or shortened device code<\/td>Identifies the device or product family<\/td>Compare it with the manufacturer\u2019s marking guide<\/td><\/tr>
Herstellungsdatum<\/td>Identifies an assembly or production period<\/td>Confirm the manufacturer\u2019s format<\/td><\/tr>
Lot or trace code<\/td>Links the unit with production records<\/td>Compare it with the package label and documents<\/td><\/tr>
Assembly code<\/td>Identifies a plant or subcontractor<\/td>Check whether the location is plausible<\/td><\/tr>
Country information<\/td>Records a defined country of origin<\/td>Ask which production step the code covers<\/td><\/tr>
Revision code<\/td>Identifies a die, mask, or product revision<\/td>Check whether that revision meets the requirement<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

A four-digit code such as 2435 may mean week 35 of 2024. That pattern is common, but it is not universal. Some manufacturers use three-digit codes, letters, internal lot references, or compressed formats on small packages.<\/p>\n\n\n\n

Date codes may refer to assembly rather than wafer fabrication. Lot codes can combine wafer, assembly, and test information in a format that only the manufacturer can decode. Ask for the correct marking convention when the code is unclear.<\/p>\n\n\n\n

Look for remarking and resurfacing indicators<\/h3>\n\n\n\n

Remarking changes the identity printed on a component. The original marking may be removed through grinding, sanding, chemical treatment, or a surface coating. A new marking is then printed or laser etched.<\/p>\n\n\n\n

Use angled light and magnification to inspect the package surface. Compare the top, bottom, and side walls rather than looking only at the printed characters.<\/p>\n\n\n\n

Warning signs include:<\/p>\n\n\n\n