{"id":3833,"date":"2026-10-16T13:46:14","date_gmt":"2026-10-16T13:46:14","guid":{"rendered":"https:\/\/duolinkelectronics.com\/?p=3833"},"modified":"2026-10-16T13:53:55","modified_gmt":"2026-10-16T13:53:55","slug":"discontinued-memory-ic-replacement","status":"publish","type":"post","link":"https:\/\/duolinkelectronics.com\/es\/discontinued-memory-ic-replacement\/","title":{"rendered":"How to Find a Replacement for a Discontinued Memory IC"},"content":{"rendered":"<p>A discontinued memory IC can leave a working product with an uncertain production schedule. The quickest available chip may solve a purchasing shortage while creating a boot failure, a programming problem, or a second obsolescence issue.<\/p>\n\n\n\n<p>Start by confirming the exact part and its lifecycle status. Then decide whether you need remaining stock of the original device, an alternative that works on the existing board, or a planned redesign. Each route needs different evidence before you issue a purchase order.<\/p>\n\n\n\n<p>This guide explains how procurement and engineering teams can build a replacement shortlist, check compatibility, and qualify a supply lot without treating a cross-reference suggestion as design approval.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">How Do You Confirm a Memory IC Is Discontinued?<\/h2>\n\n\n\n<p>Search the manufacturer&#8217;s website using the complete orderable part number, including package, speed, temperature, and other suffixes. A family name alone may hide the fact that only one package or grade has been withdrawn.<\/p>\n\n\n\n<p>Look for the product status page and a product discontinuance notice, sometimes called a PDN or EOL notice. A product change notice, or PCN, can describe a manufacturing change without ending the product. Read the notice itself rather than relying on its title.<\/p>\n\n\n\n<p>Separate three situations: a part that is unavailable today, a part not recommended for new designs, and a part being discontinued. They call for different actions. A distributor&#8217;s obsolete flag is a useful lead, but the manufacturer&#8217;s notice should establish the affected ordering codes and deadlines.<\/p>\n\n\n\n<p>Record the last-time-buy date, final shipment date, notice revision, affected parts, and any recommended migration path. Ask the manufacturer or its authorized channel for clarification if the notice does not clearly cover your suffix. Do not assume that a last-time-buy deadline means orders or quantities are guaranteed to be accepted.<\/p>\n\n\n\n<p>Keep the notice with the BOM change record. Before contacting suppliers, also capture the original datasheet revision, board revision, firmware version, and the memory&#8217;s role: boot code, parameter storage, working RAM, or bulk data storage. That role determines which differences matter most.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"949\" height=\"523\" src=\"http:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Two-eight-pin-memory-ICs-in-an-antistatic-tray.png\" alt=\"Two Eight Pin Memory ICs In An Antistatic Tray\" class=\"wp-image-3838\" title=\"\" srcset=\"https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Two-eight-pin-memory-ICs-in-an-antistatic-tray.png 949w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Two-eight-pin-memory-ICs-in-an-antistatic-tray-300x165.png 300w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Two-eight-pin-memory-ICs-in-an-antistatic-tray-768x423.png 768w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Two-eight-pin-memory-ICs-in-an-antistatic-tray-18x10.png 18w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Two-eight-pin-memory-ICs-in-an-antistatic-tray-600x331.png 600w\" sizes=\"(max-width: 949px) 100vw, 949px\" \/><figcaption class=\"wp-element-caption\">Two Eight Pin Memory ICs In An Antistatic Tray<\/figcaption><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Where Can You Find Potential Replacement Parts?<\/h2>\n\n\n\n<p>Begin with manufacturer migration guides and cross-reference tools. They can identify candidate families and explain important differences. Infineon&#8217;s <a href=\"https:\/\/community.infineon.com\/t5\/Knowledge-Base-Articles\/Infineon-NOR-Flash-Replacement-Parts\/ta-p\/284662\" target=\"_blank\" rel=\"noopener\">NOR flash replacement resource<\/a>, for example, pairs older families with migration notes or comments about the newer devices. Check the current lifecycle of every candidate; an older migration table does not establish present availability.<\/p>\n\n\n\n<p>Next, search other manufacturers by memory type and actual operating requirements. A replacement for serial NOR needs a different review from one for raw NAND, EEPROM, SRAM, or DRAM. Our guide to the <a href=\"https:\/\/duolinkelectronics.com\/es\/what-are-the-main-types-of-memory-ics\/\">main types of memory ICs<\/a> explains those distinctions before you start comparing parts.<\/p>\n\n\n\n<p>Use distributor filters and supplier suggestions to narrow the list, then retrieve the candidate&#8217;s manufacturer documentation. Require an exact part number in every proposal. Descriptions such as &#8220;equivalent 128 Mb flash&#8221; leave too much unresolved.<\/p>\n\n\n\n<p>Choose a sourcing route alongside the engineering route:<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Route<\/th><th>When it may help<\/th><th>What must be resolved<\/th><\/tr><\/thead><tbody><tr><td>Remaining original-part inventory<\/td><td>Short production bridge or service demand<\/td><td>Lot identity, condition, source history, storage, and enough quantity for the bridge<\/td><\/tr><tr><td>Alternative for the existing board<\/td><td>Hardware changes are difficult<\/td><td>Datasheet differences, boot and driver support, assembly fit, and system validation<\/td><\/tr><tr><td>PCB or architecture redesign<\/td><td>No sustainable compatible candidate exists<\/td><td>Engineering schedule, qualification scope, manufacturing changes, and future supply strategy<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>A bridge purchase needs an end date. Estimate production demand, service needs, existing usable inventory, and qualification consumption using your own forecast. Buying another batch of a discontinued part postpones the supply problem; it does not establish a continuing source.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Which Memory Specifications Must Match?<\/h2>\n\n\n\n<p>The candidate must satisfy the design&#8217;s requirements across its operating range. Some specifications need to match exactly; others can differ if engineering confirms sufficient margin. Higher capacity, a faster advertised speed, or a wider temperature rating does not settle the comparison.<\/p>\n\n\n\n<p>Build a comparison against the original datasheet and the system requirements. Include document page references and an owner for each unresolved difference.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Check<\/th><th>What to compare<\/th><th>Why a mismatch matters<\/th><\/tr><\/thead><tbody><tr><td>Memory architecture<\/td><td>NOR, raw NAND, managed storage, EEPROM, SRAM, or DRAM; serial or parallel interface<\/td><td>Similar capacity does not mean the controller can operate the device<\/td><\/tr><tr><td>Organization and addressing<\/td><td>Density, data width, address cycles, banks, pages, and erase blocks where applicable<\/td><td>Memory maps, address decoding, or update routines may change<\/td><\/tr><tr><td>Supply and I\/O<\/td><td>Recommended voltage range, logic thresholds, supply sequencing, and current<\/td><td>The existing rails and host interface must support the candidate<\/td><\/tr><tr><td>Timing<\/td><td>Access time or clock limits, latency, setup\/hold requirements, and operation timeouts<\/td><td>A nominal speed grade can hide an incompatible timing requirement<\/td><\/tr><tr><td>Mechanical fit<\/td><td>Exact package drawing, pitch, body size, height, pinout, and exposed pad if present<\/td><td>Matching pin count alone does not prove PCB or assembly compatibility<\/td><\/tr><tr><td>Software-visible behavior<\/td><td>Identification, commands, registers, reset state, protection, and addressing modes<\/td><td>Existing firmware may reject or misconfigure the new memory<\/td><\/tr><tr><td>Reliability and handling<\/td><td>Temperature grade, applicable endurance\/retention conditions, reflow limits, and moisture requirements<\/td><td>The part must suit the actual workload and assembly process<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>For serial NOR, review erase sizes, page-program behavior, write protection, reset sequences, read latency, and how the device enters or exits multi-I\/O modes. Serial Flash Discoverable Parameters, or SFDP, may help supported software discover capabilities. Confirm what your actual bootloader and driver read and use.<\/p>\n\n\n\n<p>For raw NAND, add page and spare-area layout, required error correction code (ECC), bad-block handling, and controller support. Micron&#8217;s <a href=\"https:\/\/www.micron.com\/sales-support\/sales\/faqs\" target=\"_blank\" rel=\"noopener\">memory FAQs<\/a> specifically direct designers to the device datasheet for ECC requirements and manufacturer-marked bad-block handling. A capacity match cannot resolve those differences.<\/p>\n\n\n\n<p>For EEPROM, check addressing, page-write limits, write-cycle timing, and protection behavior. For SRAM, review organization, access and control timing, and any battery-backup constraints in the circuit. DRAM replacements also need controller support for the organization, initialization, refresh, and timing configuration. Escalate any unsupported controller combination before buying qualification samples.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img decoding=\"async\" width=\"936\" height=\"486\" src=\"http:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Empty-memory-IC-footprint-on-a-green-circuit-board.png\" alt=\"Empty Memory IC Footprint On A Green Circuit Board\" class=\"wp-image-3839\" title=\"\" srcset=\"https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Empty-memory-IC-footprint-on-a-green-circuit-board.png 936w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Empty-memory-IC-footprint-on-a-green-circuit-board-300x156.png 300w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Empty-memory-IC-footprint-on-a-green-circuit-board-768x399.png 768w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Empty-memory-IC-footprint-on-a-green-circuit-board-18x9.png 18w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Empty-memory-IC-footprint-on-a-green-circuit-board-600x312.png 600w\" sizes=\"(max-width: 936px) 100vw, 936px\" \/><figcaption class=\"wp-element-caption\">Empty Memory IC Footprint On A Green Circuit Board<\/figcaption><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Is a Pin-Compatible Memory IC a Drop-In Replacement?<\/h2>\n\n\n\n<p>No. Pin compatibility describes only part of the replacement decision. The device must also work with the board&#8217;s electrical conditions, the software that accesses it, and the manufacturing process.<\/p>\n\n\n\n<p>A useful example appears in Infineon&#8217;s <a href=\"https:\/\/community.infineon.com\/gfawx74859\/attachments\/gfawx74859\/nor-flash\/7551\/1\/22553-002-17010_00_V%20%281%29.pdf\" target=\"_blank\" rel=\"noopener\">AN217010 migration guide<\/a> for S25FL164K to S25FL064L. The guide documents differences in identification behavior, commands, electrical parameters, and package options. It demonstrates why even a manufacturer-described migration needs a difference review. It is not a current stocking recommendation for either device.<\/p>\n\n\n\n<p>Check the functions of every pin, including pins previously treated as unused. Review multiplexed signals, pull-ups, reset, hold, and write-protect behavior against both datasheets and the schematic. The same footprint can still require a different circuit configuration.<\/p>\n\n\n\n<p>Use &#8220;candidate replacement&#8221; on purchasing records until engineering completes the review. Reserve &#8220;approved replacement&#8221; for a defined board revision, firmware release, operating range, and manufacturing configuration. A supplier&#8217;s &#8220;drop-in&#8221; claim should come with supporting documentation and a clear scope.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Will the Replacement Require Firmware or PCB Changes?<\/h2>\n\n\n\n<p>Answer this before purchasing production quantities. Some changes are manageable in software; others prevent the new memory from reaching the point where your software can configure it.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Check the boot path first<\/h3>\n\n\n\n<p>If the processor boots directly from external memory, inspect its boot-ROM requirements. Boot ROM may support only particular commands, bus modes, addressing schemes, or startup conditions. Updating the application driver cannot fix an incompatibility that prevents initial boot.<\/p>\n\n\n\n<p>Review the bootloader, application driver, production programmer, and field-update tool separately. Each may contain a device-ID allowlist or assumptions about erase size, page size, protection registers, or maximum operation time. A device that programs successfully in an external programmer may still fail in the finished product.<\/p>\n\n\n\n<p>Consider two hypothetical SPI NOR candidates with the same capacity and footprint. If the second device needs a different protection-register sequence, reads may work while field updates fail. The review must include write and erase behavior, not just successful firmware loading. This example illustrates a compatibility risk.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Review hardware and production dependencies<\/h3>\n\n\n\n<p>Compare the supply rails, decoupling, reset network, pull-ups, signal routing, and package land pattern. Assess signal integrity if the candidate&#8217;s interface behavior or the intended operating speed changes. Use validated timing settings rather than assuming the fastest common clock will work.<\/p>\n\n\n\n<p>Also check assembly profiles, programming adapters, fixture support, and manufacturing software. Record any changed programming algorithm and verify the programmed image. Unique identifiers, one-time-programmable regions, calibration data, or security provisioning may require a separate migration process; they cannot always be copied from the original device.<\/p>\n\n\n\n<p>If the change requires a PCB revision, plan how purchasing and manufacturing will prevent original and replacement parts from being fitted to the wrong board version.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">How Should You Test and Validate the Replacement?<\/h2>\n\n\n\n<p>Define acceptance criteria before testing samples. The plan should show which compatibility questions each test answers, the operating conditions, the hardware and firmware versions, and who approves the result.<\/p>\n\n\n\n<p>Begin with a documented datasheet comparison and known-good baseline boards. Use controlled sample lots and retain their identification. Qualification samples establish evidence for that configuration; they do not establish the condition or authenticity of every later shipment.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Validation stage<\/th><th>Practical checks<\/th><th>Release evidence<\/th><\/tr><\/thead><tbody><tr><td>Identification and setup<\/td><td>Read supported IDs and configuration; verify reset and protection states<\/td><td>Device records and configuration settings<\/td><\/tr><tr><td>Boot and operating modes<\/td><td>Cold start, warm reset, sleep\/wake, and supported supply\/temperature limits<\/td><td>Repeatable results tied to board and firmware revisions<\/td><\/tr><tr><td>Memory operations<\/td><td>Applicable read, write, erase, boundary access, and data verification tests<\/td><td>Coverage and results against defined criteria<\/td><\/tr><tr><td>Updates and recovery<\/td><td>Normal updates, rollback where supported, and controlled interrupted-update tests<\/td><td>Evidence of the required recovery behavior<\/td><\/tr><tr><td>Manufacturing trial<\/td><td>Programming, assembly, inspection, and end-of-line operation<\/td><td>Approved production settings and pilot results<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Check relevant address boundaries and partition transitions. Test the operating modes the product actually uses, including execute-in-place access where applicable. A single checksum after programming leaves many behaviors untested.<\/p>\n\n\n\n<p>Power-interruption testing deserves a specific plan. Perform it on designated samples under engineering control, account for possible corruption, and judge the result against the product&#8217;s recovery design. Do not assume the memory guarantees atomic updates unless its documentation explicitly supports that behavior.<\/p>\n\n\n\n<p>Choose sample quantities and environmental coverage according to product risk and applicable customer requirements. There is no universal sample count that qualifies every memory replacement. Automotive, medical, aerospace, or other controlled programs may need formal change approval before production use.<\/p>\n\n\n\n<p>Close the change with an updated approved-parts list, BOM, firmware dependencies, test report, and receiving requirements. If validation leaves a mismatch unresolved, hold production release and assign the next action to engineering or the supplier.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img decoding=\"async\" width=\"951\" height=\"505\" src=\"http:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Embedded-board-connected-to-a-programming-adapter.png\" alt=\"Embedded Board Connected To A Programming Adapter\" class=\"wp-image-3840\" title=\"\" srcset=\"https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Embedded-board-connected-to-a-programming-adapter.png 951w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Embedded-board-connected-to-a-programming-adapter-300x159.png 300w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Embedded-board-connected-to-a-programming-adapter-768x408.png 768w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Embedded-board-connected-to-a-programming-adapter-18x10.png 18w, https:\/\/duolinkelectronics.com\/wp-content\/uploads\/2026\/10\/Embedded-board-connected-to-a-programming-adapter-600x319.png 600w\" sizes=\"(max-width: 951px) 100vw, 951px\" \/><figcaption class=\"wp-element-caption\">Embedded Board Connected To A Programming Adapter<\/figcaption><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">What Should You Verify With Suppliers Before Ordering?<\/h2>\n\n\n\n<p>An approved design still needs an acceptable supply lot. Ask whether the quotation covers stock physically held by the seller, stock held elsewhere, or a sourcing offer. Confirm quantity and delivery conditions against the actual proposed lot.<\/p>\n\n\n\n<p>Request the full manufacturer part number, packaging type, date and lot codes where available, condition, and current photos of the offered material and labels. Clarify whether lots will be mixed and whether samples come from the same lot proposed for production. Require approval before any part, grade, lot arrangement, or packaging substitution.<\/p>\n\n\n\n<p>Ask what source-history records and conformity documents are available. A seller-issued certificate of conformity is not the same as a continuous manufacturer-to-buyer traceability record. Verify any claim of manufacturer authorization through the manufacturer&#8217;s own channel information.<\/p>\n\n\n\n<p>For older stock, review storage and repacking history, lead condition, and applicable moisture and assembly handling requirements. Date code alone does not establish fitness for use. Missing history may require additional inspection or testing; agree the scope and acceptance criteria before ordering. Visual inspection can identify concerns but cannot, by itself, prove authenticity or full electrical suitability.<\/p>\n\n\n\n<p>Our guide to <a href=\"https:\/\/duolinkelectronics.com\/es\/how-to-source-ic-chips-from-china-with-lower-risk\/\">sourcing IC chips from China with lower risk<\/a> provides further supplier-screening context. For a replacement project, keep supplier-quality acceptance separate from engineering compatibility approval.<\/p>\n\n\n\n<p>US and European buyers should state destination, application, and required declarations at the inquiry stage. Obtain applicable part-specific RoHS or REACH documentation rather than inferring compliance from a &#8220;lead-free&#8221; description. Customer requirements may also govern traceability, approved sources, qualification, or change notification.<\/p>\n\n\n\n<p>Finally, agree on inspection rights, discrepancy reporting, warranty scope, return conditions, and any non-cancellable or non-returnable terms. Put the approved part number and permitted substitutions on the purchase order. Availability claims should not override the engineering release process.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Conclusi\u00f3n<\/h2>\n\n\n\n<p>Finding a replacement for a discontinued memory IC requires both technical approval and supply verification. Confirm the discontinuance notice, compare exact devices, resolve boot and software dependencies, and validate the replacement on the intended product. Then qualify the offered lot and document the purchasing conditions.<\/p>\n\n\n\n<p>DuoLink Electronics is an independent electronic-component supplier offering IC sourcing and BOM quotation support. To discuss an original-part requirement or a replacement shortlist, contact DuoLink with the complete part number, manufacturer, quantity, application, delivery target, and documentation needs. Include any restrictions on firmware or PCB changes so candidate sourcing follows your engineering requirements. Confirm lot evidence and availability before ordering; final suitability requires your engineering approval.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Preguntas frecuentes<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Can I replace a discontinued memory IC with a higher-capacity part?<\/h3>\n\n\n\n<p>Possibly, but capacity alone is insufficient. Check controller support, addressing, memory maps, commands, package fit, and boot behavior. Approve the exact device for the intended hardware and firmware.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Does a matching JEDEC ID prove that two memory ICs are interchangeable?<\/h3>\n\n\n\n<p>No. An identification response does not validate timing, protection behavior, electrical limits, or every command. Use the datasheets and system tests to establish compatibility.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Can I use remaining stock instead of redesigning the board?<\/h3>\n\n\n\n<p>Yes, if the offered material meets your quality requirements and the quantity supports a defined production or service plan. Assess storage, source history, handling, and inspection needs before purchase.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Do replacement memory ICs need programming before assembly?<\/h3>\n\n\n\n<p>It depends on the product. Boot flash and some parameter memories need specified content or provisioning; working RAM usually does not. Confirm whether programming occurs before assembly, in-circuit, or during final test, and verify tool support.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>A discontinued memory IC can leave a working product with an uncertain production schedule. The quickest available chip may solve a purchasing shortage while creating a boot failure, a programming problem, or a second obsolescence issue. Start by confirming the exact part and its lifecycle status. Then decide whether you need remaining stock of the [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":3837,"comment_status":"closed","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[21,76],"tags":[],"class_list":["post-3833","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-sourcing-supply-chain"],"_links":{"self":[{"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/posts\/3833","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/comments?post=3833"}],"version-history":[{"count":3,"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/posts\/3833\/revisions"}],"predecessor-version":[{"id":3842,"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/posts\/3833\/revisions\/3842"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/media\/3837"}],"wp:attachment":[{"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/media?parent=3833"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/categories?post=3833"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/duolinkelectronics.com\/es\/wp-json\/wp\/v2\/tags?post=3833"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}